工程論壇主題
Mini - symposium Title
MS006 Advanced Packaging Process Technology Forum
Description
Advanced Packaging Process Technology Forum aims to explore the cutting-edge packaging technology trends in the current and future semiconductor industry. This forum focuses on the latest advancements in packaging technology, including 3D IC, Wafer-Level Packaging (WLP), Fan-Out Wafer-Level Packaging (FO-WLP), and more. Participants will have the opportunity to learn about the latest information on miniaturization, high performance, and high-density integrated packaging solutions. Additionally, the forum will discuss the challenges and innovations in reliability, structural design, and material assessment of packaging technology, as well as explore the future development direction of packaging technology.
Lead Organizer
Senior manager, R&D 1 division ,CoreTech System Co., Ltd. (Moldex3D)